MPi Fine Pictch Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is greatly used on gold bump and pad wafer tests for Screen driver, logic, and memory machine. MPI’s cantilever probes are the corresponding answer into the calls for of fi­ne pitch, smaller pad size, large pace, fewer cleansing, multi-DUT, higher pin count, and ultra-minimal leakage demands. With superb craftsmanship, revolutionary architecture and confirmed methodologies depending on mechanical and electrical simulation/measurement benefits, building MPI the highest cantilever company around the globe.


FCB Probe Card

The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is actually a verified Answer for a number of semiconductor production checks from early engineering pilot-operates to large volume producing (HVM). FCB is prepared for system requiring high sign integrity probing (SI) and/or electricity integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB ensures the planet’s most effective Over-all Expense-of-possession (COO) for a variety of DUT programs.


EVS Probe Card

The EVS Probe Card is really an enhancement over the traditional buckling beam probe card. Key options are larger present-day carrying ability (C.C.C.) and reduce balanced contact pressure (BCF), and All get more info round MEMS-like characteristics. EVS can easily fulfill the necessity of State-of-the-art wafer probing. Precise alignment and exceptional planarity control are classified as the key aspects contributing to secure Get in touch with resistance. With its capability and general performance, EVS Probe Card is a great option for Highly developed probe cards.


Osprey probe card

The Osprey probe card is MPI’s Remedy to desire for at any time finer pitch. It is made for more compact Al pad, and is particularly perfect for tiny pitch application with peripheral and total array sample. With exact alignment and improved planarity control, Osprey can attain increased efficiency by multi-DUT structure.  The forming wire (FW) type needle created with MPI’s very own micro fabrication approach not simply provides significant-high-quality performance but additionally enables straightforward needle substitute and shortens preserving cycle time.



Kestrel Probe Card

The Kestrel Probe Card is supplied with MEMS wire (MW) needle which can be made for the demand of reduced force probing. Additionally, it comes along with a chance to fulfill substantial C.C.C. and large pin counts application. The MEMS procedure ensures highly dependable needle features, plus the Specific construction design permits exact alignment and planarity Manage.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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